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Appendix III: Debentures and Bonds - Debentures and Bonds Issued (Details) € in Millions, $ in Millions	Dec. 31, 2023 EUR (€)	Dec. 31, 2023 CLP ($)
Disclosure of detailed information about borrowings [line items]
Debentures and bonds	€ 29,779
Telefónica Emisiones, S.A.U. | Telefonica Emisiones EMTN Bond | 21 November 2033
Disclosure of detailed information about borrowings [line items]
Debentures and bonds	€ 850
Telefónica Emisiones, S.A.U. | Telefonica Emisiones EMTN Bond | Fixed interest rate | 21 November 2033
Disclosure of detailed information about borrowings [line items]
Interest rate (as a percent)	4.183%	4.183%
Telefónica Móviles Chile, S.A. Wireless communications services operator | International Bond | 18 August 2028
Disclosure of detailed information about borrowings [line items]
Debentures and bonds	€ 114	$ 3
Telefónica Móviles Chile, S.A. Wireless communications services operator | International Bond | Fixed interest rate | 18 August 2028
Disclosure of detailed information about borrowings [line items]
Interest rate (as a percent)	4.7339%	4.7339%

X

- Definition

The interest rate on borrowings. [Refer: Borrowings]

+ References

Reference 1: http://www.xbrl.org/2009/role/commonPracticeRef
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-URIDate 2023-03-23

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- Definition

Line items represent concepts included in a table. These concepts are used to disclose reportable information associated with members defined in one or many axes of the table.

+ References

No definition available.

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X

- Definition

The amount of notes and debentures issued by the entity.

+ References

Reference 1: http://www.xbrl.org/2009/role/commonPracticeRef
-Name IAS
-Number 1
-IssueDate 2023-01-01
-Paragraph 112
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-URIDate 2023-03-23

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- Details

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- Details

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