Corporate | 2 May 2002 08:48
Infineon Technologies AG
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Joint News Release by Infineon and Nanya
Corporate-news announcement sent by DGAP.
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Infineon and Nanya to Cooperate on DRAM Memory Chips by Collaborating on
Technology Development and Founding a Production Joint Venture
Munich/Germany, Taoyuen/Taiwan, Mai 2, 2002 – Following successful cooperation
talks, Infineon Technologies (FSE/NYSE: IFX), Munich, and Nanya Technology
Corporation (NTC), Taoyuen/Taiwan, have signed a non-binding Memorandum of
Understanding (MoU) about a cooperation on standard memory chips (DRAMs). Under
the terms of the agreement, the two semiconductor manufacturers will co-develop
advanced 0.09-micron and 0.07-micron production technologies for 300mm wafers
starting October 2002, sharing the development costs. The companies have also
agreed to set up a 50:50 joint venture for the production of DRAM chips and to
build a new joint 300mm facility in Taiwan. The first 300mm wafers will already
be produced at the end of 2003, and in the first stage production should reach a
capacity of approximately 20,000 wafer starts per month by the second half of
2004. The joint venture will be based in Taoyuen, Taiwan, close to Nanya’s
current production facility. The transaction still requires approval by the
antitrust authorities.
“With this MoU we are systematically expanding the cooperations with Taiwanese
partners. We are resolutely strengthening our position in Asia and increasing
our share in the worldwide market for memory chips”, explained Dr. Ulrich
Schumacher, President and CEO of Infineon Technologies AG. “Nanya is an ideal
partner for us as we both operate on the same technological base. Together we
will develop future production processes on the basis of our leading 300mm
technology and build an innovative 300mm semiconductor factory in Taiwan. This
will enable us to extend our technology and cost leadership.”
“Our cooperation with Infineon represents a major step toward the combination of
both company’s strength in the trench DRAM technology development and
manufacturing”, said Dr. Jih Lien, President of Nanya Technology.
The two companies will jointly develop the new 0.09-micron and 0.07-micron
production technology at Infineon’s Dresden plant and also use it in the new
joint venture facility. Production of 300mm wafers using the new 0.09-micron
process will start in the new joint plant in Taoyuen at the end of 2003.
Furthermore, it is planned to deploy the 0.09-micron production technology also
for 200mm wafers. The basis for the joint development of the future production
technology is the advanced DRAM trench technology for 300mm wafers from
Infineon, which the company is licensing to Nanya. Infineon was the first
company worldwide to start volume production of 300mm technology at the end of
last year at its Dresden reference facility. The switch to the smaller 0.09-
micron and 0.07-micron geometries in chip design will enable a further boost in
productivity.
The production joint venture in Taoyuen will be integrated into Infineon’s
international cluster of DRAM production sites, which comprises the production
facilities in Dresden (Germany), Richmond, Virginia (USA) and ProMOS
Technologies, the joint venture with Mosel Vitelic in Hsinchu (Taiwan). This
concept of a global network of manufacturing plants guarantees the same high
quality standards at all sites around the world and constant know-how transfer.
About Nanya
Nanya Technology Corporation (NTC) was founded on March 4, 1995. NTC specializes
in research and development, design, production and sales of semiconductor
products. Company President and CEO is Y.C. Wang, and the company’s largest
shareholder is Nanya Plastics Corporation (Formosa Plastic Group). NTC began
production of semiconductors in 1996 and opened its North American office in San
Jose, California in 1997. The company has offered its foundry services since
1997. Further information on Nanya Technology is available on +1-408 441 7819 or
at http://www.nanya.com. NTC headquarters in Taiwan can be reached on 886-3-
328-1688 or at http://www.ntc.com.
About Infineon
Infineon Technologies AG, Munich, offers semiconductor and system solutions for
applications in the wired and wireless communications markets, for security
systems and smart cards, for the automotive and industrial sectors, as well as
memory products. A global player, Infineon operates in the USA from San Jose,
California, in the Asia-Pacific region from Singapore and in Japan from Tokyo.
Employing about 33,800 people worldwide, the company achieved sales of EUR 5.67
billion in fiscal 2001 (ending September). Infineon is listed on the DAX index
of the Frankfurt Stock Exchange and on the New York Stock Exchange (NYSE) under
the ticker symbol IFX. Further information is available at www.infineon.com.
Safe Habor Statement
This press release contains forward-looking statements based on current
expectations or beliefs, as well as a number of assumptions about future events.
These statements and all other statements that are not historical facts, are
subject to factors and uncertainties that could cause actual results to differ
materially from those described in the forward-looking statements. The reader is
cautioned not to put undue reliance on these forward-looking statements, which
are not a guarantee of future performance and are subject to a number of
uncertainties and other factors, many of which are outside the control of
Infineon and Nanya. The forward-looking statements in this release address a
variety of subjects including, for example, the expected closing of the
acquisition and the potential benefits of the acquisition. The following
factors, among others, could cause actual results to differ materially from
those described in these forward-looking statements: the integration of Nanya’s
and Infineon’s business; costs associated with the acquisition; the successful
completion of the acquisition; including applicable regulatory requirements
relating to the transaction; increased competition and technological changes in
the industries in which Nanya and Infineon operate. For a detailed discussion of
these and other cautionary statements, please, refer to Infineon’s filings with
the Securities and Exchange Commission.
end of message, (c)DGAP 02.05.2002