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Commitments and Contingencies | 12 Months Ended
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Mar. 29, 2014
Commitments and Contingencies [Abstract] |
Commitments and Contingencies | 13. Commitments and Contingencies Facilities and Equipment Under Operating Lease Agreements With the exception of our corporate headquarters and select surrounding properties, we lease our facilities and certain equipment under operating lease agreements, some of which have renewal options. Certain of these arrangements provide for lease payment increases based upon future fair market rates. As of May 1, 201 4, our principal facilities are located in Austin, Texas. The Company closed operations in Tucson, Arizona during fiscal year 2013, which included 28,000 square feet of leased office space which was primarily occupied by engineering personnel. The term of this lease extends through May 2015. The aggregate minimum future rental commitments under all operating leases, net of sublease income, for the following fiscal years are (in thousands):
|  | Facilities |  |  | Subleases |  |  | Net Facilities Commitments |  |  | Equipment Commitments |  |  | Total Commitments
2015 | $ | 3,292 |  | $ | 238 |  | $ | 3,054 |  | $ | 11 |  | $ | 3,065
2016 |  | 2,623 |  |  | 27 |  |  | 2,596 |  |  | 8 |  |  | 2,604
2017 |  | 2,519 |  |  | - |  |  | 2,519 |  |  | 5 |  |  | 2,524
2018 |  | 823 |  |  | - |  |  | 823 |  |  | 5 |  |  | 828
2019 |  | 373 |  |  | - |  |  | 373 |  |  | 4 |  |  | 377
Thereafter |  | - |  |  | - |  |  | - |  |  | - |  |  | -
Total minimum lease payment | $ | 9,630 |  | $ | 265 |  | $ | 9,365 |  | $ | 33 |  | $ | 9,398
Total rent expense was approximately $2.8 million, $3.2 million, and $4.7 million, for fiscal years 2014, 2013, and 2012, respectively. Sublease rental income was $0.1 million, $0.1 million, $0.4 million, for fiscal years 2014, 2013, and 2012, respectively. Wafer, Assembly and Test Purchase Commitments We rely primarily on third-party foundries for our wafer manufacturing needs. As of March 29, 201 4, we had agreements with multiple foundries for the manufacture of wafers. On December 22, 2011, the Company entered into a $10 million Capacity Investment and Loading Agreement with STATS ChipPAC Ltd (Supplier Agreement) in order to secure assembly and test capacity for certain products. A s part of the agreement, we are eligible to receive rebates on our purchases up to the full amount of the specified $10 million in the Supplier Agreement upon our meeting certain purchase volume milestones. We have utilized $2.6 million and $4.3 million during fiscal year s 2014 and 2013, respectively, related to the agreement and expect to receive the full amount of our $10 million payments back in rebates through fiscal year 2015, b ased on our current projections. Other than the previously mentioned agreement, our foundry agreements do not have volume purchase commitments or "take or pay" clauses and provide for purchase commitments based on purchase orders. Cancellation fees or other charges may apply and are generally dependent upon whether wafers have been started or the stage of the manufacturing process at which the notice of cancellation is given. As of March 29, 201 4, we had foundry commitments of $36.7 million. In addition to our wafer supply arrangements, we contract with third-party assembly vendors to package the wafer die into finished products. Assembly vendors provide fixed-cost-per-unit pricing, as is common in the semiconductor industry. We had non-cancelable assembly purchase orders with numerous vendors totaling $2.1 million at March 29, 201 4. Test vendors provide fixed-cost-per-unit pricing, as is common in the semiconductor industry. Our total non-cancelable commitment for outside test services as of March 29, 2014 was $5.3 million.

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