# Filing Detail

Form 6-K - Report of foreign issuer [Rules 13a-16 and 15d-16]:
SEC Accession No. 0001193125-20-215561
Filing Date
2020-08-11
Accepted
2020-08-11 06:11:02
Documents
23
Period of Report
2020-08-11

Document Format Files

Seq | Description | Document | Type | Size
--- | --- | --- | --- | ---
1 | FORM 6-K | d73169d6k.htm | 6-K | 10279
2 | EX-99.1 | d73169dex991.htm | EX-99.1 | 14107
3 | EX-99.2 | d73169dex992.htm | EX-99.2 | 15461
4 | GRAPHIC | g73169ex99_2s10g1.jpg | GRAPHIC | 273533
5 | GRAPHIC | g73169ex99_2s11g1.jpg | GRAPHIC | 59620
6 | GRAPHIC | g73169ex99_2s12g1.jpg | GRAPHIC | 219257
7 | GRAPHIC | g73169ex99_2s13g1.jpg | GRAPHIC | 281809
8 | GRAPHIC | g73169ex99_2s14g1.jpg | GRAPHIC | 243167
9 | GRAPHIC | g73169ex99_2s15g1.jpg | GRAPHIC | 189954
10 | GRAPHIC | g73169ex99_2s16g1.jpg | GRAPHIC | 190774
11 | GRAPHIC | g73169ex99_2s17g1.jpg | GRAPHIC | 60928
12 | GRAPHIC | g73169ex99_2s18g1.jpg | GRAPHIC | 338525
13 | GRAPHIC | g73169ex99_2s19g1.jpg | GRAPHIC | 89488
14 | GRAPHIC | g73169ex99_2s1g1.jpg | GRAPHIC | 368101
15 | GRAPHIC | g73169ex99_2s2g1.jpg | GRAPHIC | 394614
16 | GRAPHIC | g73169ex99_2s3g1.jpg | GRAPHIC | 122893
17 | GRAPHIC | g73169ex99_2s4g1.jpg | GRAPHIC | 62520
18 | GRAPHIC | g73169ex99_2s5g1.jpg | GRAPHIC | 250156
19 | GRAPHIC | g73169ex99_2s6g1.jpg | GRAPHIC | 240624
20 | GRAPHIC | g73169ex99_2s7g1.jpg | GRAPHIC | 157644
21 | GRAPHIC | g73169ex99_2s8g1.jpg | GRAPHIC | 219982
22 | GRAPHIC | g73169ex99_2s9g1.jpg | GRAPHIC | 239962
23 | GRAPHIC | g73169img001.jpg | GRAPHIC | 8412
| Complete submission text file | 0001193125-20-215561.txt |  | 5568520

Mailing Address NO. 1, R & D ROAD 1 HSINCHU SCIENCE PARK, HSINCHU TAIWAN F5 00000
Business Address NO. 1, R & D ROAD 1 HSINCHU SCIENCE PARK, HSINCHU TAIWAN F5 00000 866-3-5770055
CHIPMOS TECHNOLOGIES INC (Filer) CIK: 0001123134 (see all company filings)

EIN.: 000000000 | State of Incorp.: F5 | Fiscal Year End: 1231
Type: 6-K | Act: 34 | File No.: 001-37928 | Film No.: 201091002
SIC: 3674 Semiconductors & Related Devices