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Memory IC Product End-of-Life
 6 Months Ended
Jun. 30, 2023
Memory IC Product End-of-Life [Abstract]  
Memory IC Product End-of-Life

Note 11. Memory IC Product End-of-Life

 

Taiwan Semiconductor Manufacturing Corporation (TSMC), is the sole foundry that manufactures the wafers used to produce the Company’s memory IC products. TSMC has informed the Company that TSMC would be discontinuing the foundry process used to produce wafers, in turn, necessary to manufacture the Company’s memory ICs. As a result, in May 2023, the Company informed its customers that the Company would be initiating an end-of-life (EOL) of its memory IC products. The Company has notified its customers to provide purchase orders during 2023 that the Company expects to fulfill during 2024 and into 2025. However, the timing of EOL shipments will be dependent on receipt of customer purchase orders, deliveries from the Company’s suppliers and the delivery schedules requested by customers.