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Memory IC Product End-of-Life | 12 Months Ended
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Dec. 31, 2023
Memory IC Product End-of-Life [Abstract] |
Memory IC Product End-of-Life | Note 12. Memory IC Product End-of-Life Taiwan Semiconductor Manufacturing Corporation (TSMC) is the sole foundry that manufactures the wafers used to produce the Company’s memory IC products. TSMC informed the Company that TSMC is discontinuing the foundry process used to produce wafers, in turn, necessary to manufacture the Company’s memory ICs. As a result, in May 2023, the Company informed its customers that the Company would be initiating an end-of-life (EOL) of its memory IC products. Through December 31, 2023, the Company had received non-cancelable purchase orders from customers totaling approximately $14,000,000. During the period from July 1, 2023 to December 31, 2023 the Company commenced initial shipments of EOL orders and fulfilled approximately $3,700,000 of these initial purchase orders. Based on customer purchase orders in the Company’s backlog, the Company expects to ship additional EOL orders of approximately $10,300,000 over the 12 to 15 month period commencing January 1, 2024.

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