XML 27 R17.htm IDEA: XBRL DOCUMENT v3.25.2

Memory IC Product End-of-Life	6 Months Ended
	Jun. 30, 2025
Memory IC Product End-of-Life [Abstract]
Memory IC Product End-of-Life	Note 11. Memory IC Product End-of-Life Taiwan Semiconductor Manufacturing Corporation, the sole foundry that manufactured the wafers used to produce the Company’s memory IC products, discontinued the foundry process used to produce such wafers. As a result, the Company commenced an end-of-life (EOL) of its memory products in 2023. In March 2025, the Company fulfilled all outstanding EOL orders for its memory IC products.

X

- Definition

The disclosure of memory product end of life.

+ References

No definition available.

+ Details

Name:	prso_MemoryICProductEndofLifeTextBlock
Namespace Prefix:	prso_
Data Type:	dtr:textBlockItemType
Balance Type:	na
Period Type:	duration

X

- References

No definition available.

+ Details

Name:	us-gaap_PaymentsForProceedsFromLifeInsurancePoliciesAbstract
Namespace Prefix:	us-gaap_
Data Type:	xbrli:stringItemType
Balance Type:	na
Period Type:	duration