Thinfilm Files Patent for Printable Protection for Memory Devices

New protection method significant improvement from conventional approach of
protecting printed devices, meets requirements for durability and low cost.

OSLO, 19 June, 2012 - Thin Film Electronics ASA ("Thinfilm")  (OSE: THIN.OL)
today announced that it has developed and is patenting a low-cost printable
protection for ferroelectric memory products. The protection safeguards
nanoscale structures from mechanical stress, including shear forces, ensuring
printed memory products meet customer requirements for durability while being
highly cost efficient.

The low-cost printable protection is currently used in two Thinfilm Memory(TM)
products: The 20-bit single-line Thinfilm Memory for consumer applications such
as toys, games and info-kiosks, and the bit-scalable Thinfilm Passive Array
Memory(TM), delivered as engineering samples earlier this year. Thinfilm's novel
printed protection layer is also expected to be applicable to other sub-micron-
thickness functional components.

Printable protection differs significantly from the conventional approach of
protecting printed devices, which seals them using foil or a protective sheet.
In the new Thinfilm approach, stress- and scratch-resistant films are printed on
top of the memory during the manufacturing process making the patent-pending
technique particularly suitable for high-volume production.

The patent application for the low-cost printable protection has been submitted
to the Swedish Patent and Registration Office, as well as to the World
Intellectual Property Organization under the terms of the international Patent
Cooperation Treaty.

"Our customers require durable protection against scratching, abrasion and
ordinary handling, and because of its use in cost-sensitive applications, the
memory must also very be affordable. The new printable protection is a key
factor in enabling the production of printed devices that meet both needs," says
Dr. Christer Karlsson, CTO of Thinfilm.

Protection presented at LOPE-C on 21 June

The protection technology will be presented for the first time during LOPE-C in
Munich, Germany on 21 June, 2012, by Dr. Jakob Nilsson, Team Manager Memory
Products. The presentation will be held in conjunction with the Technical
Conference in Room 13a at 4:00 PM CET.



About Thinfilm

Thin Film Electronics ASA (Ticker: THIN.OL) is a leader in the development of
printed electronics. The first to commercialize printed rewritable memory,
Thinfilm is creating printed system products that will include sensing, display
and wireless communication-at a cost-per-functionality unmatched by any other
electronic technology. Thinfilm's roadmap of system products integrates
technology from a strong and growing ecosystem of partners to enable the
Internet of Things by bringing intelligence to disposable goods. Company
headquarters are in Oslo, Norway, with product development in Linköping, Sweden,
sales offices in San Francisco, USA, and Tokyo, Japan, and manufacturing in
Pyongtaek, South Korea.

www.thinfilm.no

www.twitter.com/ThinfilmMemory

www.linkedin.com/company/thin-film-electronics



For more information, please contact

Johanna Puustinen

Senior Communications Manager

+47 918 78 673

jp@thinfilm.no


This information is subject of the disclosure requirements pursuant to section
5-12 of the Norwegian Securities Trading Act.
This information is subject of the disclosure requirements acc. to §5-12 vphl
(Norwegian Securities Trading Act)


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