First commercial agreement in printed electronics to create integrated printed
systems for high volume production and multiple markets.

OSLO, 10 July 2012 - Thin Film Electronics ASA ("Thinfilm") (OSE: THIN.OL), a
leader in development of printed electronics, and Bemis Company, Inc ("Bemis")
(NYSE:BMS), a Fortune 500 supplier of flexible packaging and pressure sensitive
materials, today announced an agreement to develop a flexible sensing platform
for the packaging market. The result will be a new category of packaging that
can collect and wirelessly communicate sensor information, for use by leading
food, consumer products and healthcare companies worldwide.

Thinfilm has previously announced technology partnerships to develop an
inexpensive, integrated time-temperature sensor for use in monitoring perishable
goods and pharmaceuticals. Under the agreement with Bemis, Thinfilm will extend
this work to create a customizable sensor platform that Bemis will subsequently
tailor to its customers' individual requirements. The Intelligent Packaging
Platform can be adapted to monitor and record key physical properties and
environmental data in packaged perishable products.

"Intelligent packaging is an emerging technology with many potential
intersections with Bemis' flexible packaging and pressure sensitive materials
business segments," said Henry Theisen, Bemis Company President and Chief
Executive Officer. "Our agreement with Thinfilm represents an investment in a
technology that could eventually make printed electronics a component of every
package we manufacture."

Bemis' packaging is used for a wide range of products from meat and cheese to
medical devices and personal care items. Its customers include leading food and
consumer products companies around the world.

The flexible packaging market for North America alone is estimated by PCI Films
Consulting Ltd to be $18.3 Billion.

"These are exciting times for the printed electronics market, where innovative
solutions that simply could not be manufactured before are soon to be
delivered," said Davor Sutija, CEO, Thinfilm. "Our partnership with Bemis will
lead to new categories and types of packaging that will bring intelligence to
the everyday lives of millions of people worldwide. We are excited to work with
the company because of their distinguished history of innovation and their
vision for printed electronics."

"The relationship between Bemis and Thinfilm is a clear sign that the printed
electronics market is entering a new commercial phase. While vendors have
created standalone components, the integrated systems commercialized through
this partnership are truly disruptive," said Dr. Malcolm J. Thompson, founder
and Director Emeritus of the FlexTech Alliance. "Vendors who have waited to see
what printed and flexible electronics can offer should take this as a strong
sign that now is the time to be seriously evaluating the new product
opportunities that printed electronics can generate."

The Bemis Intelligent Packaging Platform is expected to be commercially
available in 2014.

About Bemis
Bemis Company is a major supplier of flexible packaging and pressure sensitive
materials used by leading food, consumer products, healthcare and other
companies worldwide. Founded in 1858, the Company is included in the S&P 500
index of stocks and reported 2011 net sales of $5.3 billion. The Company's
flexible packaging business has a strong technical base in polymer chemistry,
film extrusion, coating and laminating, printing and converting. Headquartered
in Neenah, Wisconsin, Bemis employs approximately 20,000 individuals worldwide.
More information about the Company is available at www.bemis.com.

About Thinfilm
Thin Film Electronics ASA (Ticker: THIN.OL) is a leader in the development of
printed electronics. The first to commercialize printed rewritable memory,
Thinfilm is creating printed system products that will include memory, sensing,
display and wireless communication-at a cost-per-functionality unmatched by any
other electronic technology. Thinfilm's roadmap of system products integrates
technology from a strong and growing ecosystem of partners to enable the
Internet of Things by bringing intelligence to disposable goods. Company
headquarters are in Oslo, Norway, with product development in Linköping, Sweden,
sales offices in San Francisco, USA, and Tokyo, Japan, and manufacturing in
Pyongtaek, South Korea. www.thinfilm.no

http://twitter.com/ThinfilmMemory

http://www.linkedin.com/company/thin-film-electronics

For more information, please contact
Johanna Puustinen
Senior Communications Manager
+47 918 78 673
jp@thinfilm.no

This information is subject of the disclosure requirements pursuant to section
5-12 of the Norwegian Securities Trading Act.

[HUG#1625408]

Bemis Selects Thin Film Electronics to Develop Intelligent Packaging Platform