Other Capital Market Information | 20 November 2014 16:21
SAP SE / New loan issues and their warranties according to ยง 30e Para. 1, No. 2 of the WpHG [the German Securities Trading Act]
20.11.2014 16:21
Dissemination of a Post-admission Duties announcement according to Article 30e Para. 1, No. 2 WpHG, transmitted by
DGAP - a service of EQS Group AG.
The issuer is solely responsible for the content of this announcement.
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In November 2014, SAP SE issued under its EUR 6 billion Debt Issuance
Program established in April 2014 a euro-denominated note in three tranches
as follows:
First Bond Tranche:
Aggregated nominal amount: EUR 750 million
Coupon: 3-Months-Euribor + 30bps p.a.
ISIN: DE000A13SL18
Final Maturity: 11/20/2018
Second Bond Tranche:
Aggregated nominal amount: EUR 1 billion
Coupon: 1.125 % p.a.
ISIN: DE000A13SL26
Final Maturity: 02/20/2023
Third Bond Tranche:
Aggregated nominal amount: EUR 1 billion
Coupon: 1.75 % p.a.
ISIN: DE000A13SL34
Final Maturity: 02/22/2027
The bonds are listed on the Luxembourg Stock Exchange. Further details are
available on the website of the Luxembourg Stock Exchange (www.bourse.lu).
20.11.2014 The DGAP Distribution Services include Regulatory Announcements,
Financial/Corporate News and Press Releases.
Media archive at www.dgap-medientreff.de and www.dgap.de
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Language: English
Company: SAP SE
Dietmar-Hopp-Allee 16
69190 Walldorf
Germany
Internet: www.sap.com
End of Announcement DGAP News-Service
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