-----BEGIN PRIVACY-ENHANCED MESSAGE-----
Proc-Type: 2001,MIC-CLEAR
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<SEC-DOCUMENT>0000950172-04-000038.txt : 20040108
<SEC-HEADER>0000950172-04-000038.hdr.sgml : 20040108
<ACCEPTANCE-DATETIME>20040108101232
ACCESSION NUMBER:		0000950172-04-000038
CONFORMED SUBMISSION TYPE:	6-K
PUBLIC DOCUMENT COUNT:		6
CONFORMED PERIOD OF REPORT:	20031231
FILED AS OF DATE:		20040108

FILER:

	COMPANY DATA:	
		COMPANY CONFORMED NAME:			ASML HOLDING NV
		CENTRAL INDEX KEY:			0000937966
		STANDARD INDUSTRIAL CLASSIFICATION:	SPECIAL INDUSTRY MACHINERY, NEC [3559]
		IRS NUMBER:				000000000
		FISCAL YEAR END:			1231

	FILING VALUES:
		FORM TYPE:		6-K
		SEC ACT:		1934 Act
		SEC FILE NUMBER:	000-25566
		FILM NUMBER:		04514536

	BUSINESS ADDRESS:	
		STREET 1:		DE RUN 1110
		CITY:			LA VELDHOVEN NE
		STATE:			P7
		ZIP:			5503
		BUSINESS PHONE:		3140580800

	FORMER COMPANY:	
		FORMER CONFORMED NAME:	ASM LITHOGRAPHY HOLDING NV
		DATE OF NAME CHANGE:	19950215
</SEC-HEADER>
<DOCUMENT>
<TYPE>6-K
<SEQUENCE>1
<FILENAME>lon334339.txt
<TEXT>




                       SECURITIES AND EXCHANGE COMMISSION
                             WASHINGTON, D.C. 20549
                             ______________________

                                    FORM 6-K

                           REPORT OF A FOREIGN ISSUER
                       PURSUANT TO RULE 13A-16 OR 15D-16
                     OF THE SECURITIES EXCHANGE ACT OF 1934
                         FOR THE MONTH OF DECEMBER 2003

                             ______________________

                               ASML HOLDING N.V.

                                  De Run 6501
                               5504 DR Veldhoven
                                The Netherlands
                    (Address of principal executive offices)
                             ______________________

Indicate by check mark whether the registrant files or will file annual reports
under cover of Form 20-F or Form 40-F.

                            Form 20-F [x] Form 40-F [ ]

Indicate by check mark whether the registrant by furnishing the information
contained in this Form is also thereby furnishing the information to the
Commission pursuant to Rule 12g3-2(b) under the Securities Exchange Act of
1934.

                                   Yes [ ] No [x]

If "Yes" is marked, indicate below the file number assigned to the registrant
in connection with Rule 12g3-2(b):


EXHIBITS

99.1     "ASML Announces Update of Backlog for Customer Orders," dated December
         2, 2003.

99.2     "ASML Introduces Industry's First Immersion Lithography Tool," dated
         December 3, 2003.

99.3     "TSMC Selects ASML for Industry's First Immersion Tool Order," dated
         December 3, 2003.

99.4     "Media Advisory: ASML MaskTools and Photronics Form Strategic Alliance
         for CPL(TM)Mask Making Infrastructure," dated December 17, 2003.

99.5     "ASML Introduces TWINSCAN XT: 1250i for Immersion Lithography,"
         presentation dated December 3, 2003.

         "Safe Harbor" Statement under the U.S. Private Securities Litigation
Reform Act of 1995: the matters discussed in this document may include
forward-looking statements that are subject to risks and uncertainties
including, but not limited to, economic conditions, product demand and industry
capacity, competitive products and pricing, manufacturing efficiencies, new
product development, ability to enforce patents, the outcome of intellectual
property litigation, availability of raw materials and critical manufacturing
equipment, trade environment, and other risks indicated in filings with the
U.S. Securities and Exchange Commission.

<PAGE>

                                   SIGNATURES

         Pursuant to the requirements of the Securities Exchange Act of 1934,
the registrant has duly caused this report to be signed on its behalf by the
undersigned, thereunto duly authorized.

                                            ASML HOLDING N.V. (Registrant)

Date: January 8, 2003                       By:    /s/ Peter T.F.M. Wennink
                                               -------------------------------
                                                   Peter T.F.M. Wennink
                                                   Executive Vice President
                                                   and Chief Financial Officer







</TEXT>
</DOCUMENT>
<DOCUMENT>
<TYPE>EX-99
<SEQUENCE>3
<FILENAME>asmlex1.txt
<DESCRIPTION>EXHIBIT 1
<TEXT>
                                                                EXHIBIT 99.1

ASML ANNOUNCES UPDATE OF BACKLOG FOR CUSTOMER ORDERS

VELDHOVEN, the Netherlands, December 2, 2003 - ASML Holding NV (ASML) today
announced that, based on its backlog of customer orders as of December 1 and
its anticipated system shipments through year end, the company expects its
order backlog at December 31, 2003 will be greater than its previously
disclosed order backlog of 91 systems as of September 28, 2003.

ASML indicated today's announcement was to update cautionary statements, made
in its Q3 2003 results conference call, that the company's backlog potentially
could decline in the fourth quarter.

"The volatility of customer demand continues. In the past two weeks, the intake
process has shown considerable strength and we will continue to pursue further
orders through year end," said Doug Dunn, president and CEO, ASML.

Due to uncertain market conditions, ASML continues to refrain from issuing
further guidance or forecasts.

About ASML

ASML is the world's leading provider of lithography systems for the
semiconductor industry, manufacturing complex machines that are critical to the
production of integrated circuits or chips. Headquartered in Veldhoven, the
Netherlands, ASML is traded on Euronext Amsterdam and NASDAQ under the symbol
ASML.

ASML
Tom McGuire
Vice President Communications
corpcom@asml.com
+31.40.268.5758
+31.40.268.3655

ASML
Elizabeth Kitchener
Director Corporate Communications
corpcom@asml.com
+31.40.268.2602
+31.40.268.3655

ASML
Doug Marsh
Vice President Institutional Investor Relations U.S.
doug.marsh@asml.com
+1.480.383.4006
+1.480.383.3976


ASML
Craig DeYoung
Director Investor Relations
craig.deyoung@asml.com
+31.40.268.3938
+31.40.268.3655


</TEXT>
</DOCUMENT>
<DOCUMENT>
<TYPE>EX-99
<SEQUENCE>4
<FILENAME>asmlex2.txt
<DESCRIPTION>EXHIBIT 2
<TEXT>
                                                                  EXHIBIT 99.2

ASML INTRODUCES INDUSTRY'S FIRST IMMERSION LITHOGRAPHY TOOL

SEMICON JAPAN, Tokyo, Japan - December 3, 2003 - ASML Holding NV (ASML) today
announced the industry's first immersion lithography system - the TWINSCAN(TM)
XT:1250i - a 0.85 NA, 193 nm pre-production lithography scanner that combines
the improved depth of focus of immersion tools with the precision of "dry"
lithography systems. ASML has already booked a customer order for the XT:1250i
with initial delivery set for Q3 2004.

ASML has a unique competitive advantage in immersion techniques due, in part,
to the dual-stage design of its TWINSCAN system. Wafer measurement - including
focus and overlay - is completed in the dry stage (the metrology station) while
the imaging process, using immersion fluid applied between the wafer and the
lens, is completed in the other, wet stage (the exposure station). The
dual-stage advantage of TWINSCAN systems enables customers to gain the process
enhancements of immersion and continue with familiar and proven metrology.

Another benefit to customers from ASML immersion systems includes the similar
lenses used for both immersion and dry lithography. Customers choose the
systems that meet their needs and only slight lens modifications are required.

"ASML marks its technology leadership with another industry first - the first
ever pre-production immersion system. Our customers and the market have long
debated the benefits of 157 nm vs. immersion technologies. With the
introduction of the XT:1250i, ASML has committed itself to be the only company
that delivers both. Customers have their choice," said Doug Dunn, president and
CEO, ASML.

The XT:1250i is the immersion version of ASML's recently announced TWINSCAN
XT:1250. Both systems operate at the 65-nm node with half-pitch resolution at
70 nm. The XT:1250 is geared for advanced production, while the XT:1250i allows
customers to test and qualify immersion processes. The XT:1250 and XT:1250i
come equipped with Ultra-k1(TM), a hardware and software portfolio that enables
chipmakers to shrink circuit features, ensure high die yields and maximize
bottom-line return.

About ASML

ASML is the world's leading provider of lithography systems for the
semiconductor industry, manufacturing complex machines that are critical to the
production of integrated circuits or chips. Headquartered in Veldhoven, the
Netherlands, ASML is traded on Euronext Amsterdam and NASDAQ under the symbol
ASML.

ASML
Tom McGuire
Vice President Communications
corpcom@asml.com
+31.40.268.5758
+31.40.268.3655

ASML
Elizabeth Kitchener
Director Corporate Communications
corpcom@asml.com
+31.40.268.2602
+31.40.268.3655

ASML
Doug Marsh
Vice President Institutional Investor Relations U.S.
doug.marsh@asml.com
+1.480.383.4006
+1.480.383.3976

ASML
Craig DeYoung
Director Investor Relations
craig.deyoung@asml.com
+31.40.268.3938
+31.40.268.3655


</TEXT>
</DOCUMENT>
<DOCUMENT>
<TYPE>EX-99
<SEQUENCE>5
<FILENAME>asmlex3.txt
<DESCRIPTION>EXHIBIT 3
<TEXT>

                                                                EXHIBIT 99.3

TSMC SELECTS ASML FOR INDUSTRY'S FIRST IMMERSION TOOL ORDER


SEMICON JAPAN, Tokyo, Japan - December 3, 2003 - ASML Holding NV (ASML) today
announced it received the industry's first order for an immersion lithography
system from long-term partner Taiwan Semiconductor Manufacturing Company
(TSMC). The new tool - ASML's TWINSCAN(TM) XT:1250i - is a high productivity,
immersion scanner for production applications. Delivery is slated for Q3 2004.
No financial details of the sale are being disclosed.

TSMC, the world's largest independent semiconductor foundry, has been an
industry driver of immersion lithography, which replaces the air between the
wafer and the lens with fluid to improve depth of focus and extend existing
wavelengths to higher resolution nodes. The market for immersion lithography
tools is projected to go from zero to US$ 230 million by 2005, according to
industry analysts.

"ASML is committed to delivering the right tool, to the right customer at the
right time. We are pleased that TSMC selected ASML's TWINSCAN systems to enable
their immersion technology program," said Doug Dunn, president and CEO, ASML.
"Many of the chip manufacturers with whom we work are interested in immersion
as it provides an alternative solution to support their roadmaps and enriches
their investments. ASML is pleased to have the technology and know how to make
immersion a commercial reality."

"Immersion technology will increase the process window of our most advanced
applications. The XT:1250i allows TSMC to start using immersion technology in a
manufacturing environment," said Dr. Burn Lin, senior director of TSMC's
micropatterning technology division.

The XT:1250i is the immersion version of ASML's recently announced TWINSCAN
XT:1250, geared for advanced production. TSMC will use the XT:1250i to test and
develop immersion technology as a volume manufacturing solution. Additionally,
ASML has a demonstration / development immersion tool available in its
Veldhoven Research and Development Center.

ASML has a unique competitive advantage in immersion techniques due, in part,
to the dual-stage design of its TWINSCAN system. Wafer measurement - including
focus and overlay - is completed in the dry stage (the metrology station) while
the imaging process, using immersion fluid applied between the wafer and the
lens, is completed in the other, wet stage (the exposure station). The
dual-stage advantage of TWINSCAN systems enables customers to gain the process
enhancements of immersion and to continue with familiar and proven metrology.

About ASML

ASML is the world's leading provider of lithography systems for the
semiconductor industry, manufacturing complex machines that are critical to the
production of integrated circuits or chips. Headquartered in Veldhoven, the
Netherlands, ASML is traded on Euronext Amsterdam and NASDAQ under the symbol
ASML.

ASML
Tom McGuire
Vice President Communications
corpcom@asml.com
+31.40.268.5758
+31.40.268.3655

ASML
Elizabeth Kitchener
Director Corporate Communications
corpcom@asml.com
+31.40.268.2602
+31.40.268.3655

ASML
Doug Marsh
Vice President Institutional Investor Relations U.S.
doug.marsh@asml.com
+1.480.383.4006
+1.480.383.3976

ASML
Craig DeYoung
Director Investor Relations
craig.deyoung@asml.com
+31.40.268.3938
+31.40.268.3655


</TEXT>
</DOCUMENT>
<DOCUMENT>
<TYPE>EX-99
<SEQUENCE>6
<FILENAME>asmlex4.txt
<DESCRIPTION>EXHIBIT 4
<TEXT>


                                                                 EXHIBIT 99.4

MEDIA ADVISORY: ASML MASKTOOLS AND PHOTRONICS FORM STRATEGIC ALLIANCE
FOR CPL(TM)MASK MAKING INFRASTRUCTURE

Santa Clara, California and Brookfield, Connecticut, December 17, 2003 - ASML
MaskTools and Photronics, Inc. (NASDAQ: PLAB), today announced a strategic
alliance to develop a production-ready, mask making infrastructure for ASML
MaskTools' CPL(TM) Technology. CPL is a resolution enhancement technique that
enables low k1 lithography at advanced technology nodes. Customers using CPL
Technology have the potential to extend the lifecycle of their current 193 nm
processes to 90 nm and 65 nm nodes and, thereby, maximize their investments.

"ASML welcomes Photronics as the newest partner in our fast maturing CPL
Technology development program. They will provide value to the program through
their expertise and experience in high volume mask manufacturing," said Dinesh
Bettadapur, president and CEO, ASML MaskTools. "Establishing an efficient mask
making infrastructure is one of the keys to enabling the adoption of a new
technology such as CPL."

A single mask, single exposure resolution enhancement technique, CPL can be
broadly applied to logic and memory devices and is primarily targeted toward
critical gate and contact layers.

Adoption of CPL technology by semiconductor manufacturers and foundries
requires the availability of three critical components: leading edge software,
advanced imaging systems and high-end photomasks. ASML MaskTools will deliver
the software component through its LithoCruiser(R) (CPL imaging simulation) and
MaskWeaver(TM) (full-chip CPL mask data conversion) products. ASML will deliver
the imaging components through its KrF and ArF TWINSCAN(TM) platform including
the recently announced XT:1250 scanner. Photronics will deliver the mask
component through the delivery of high quality CPL masks.

"As we transition to smaller and smaller geometries, the lithography challenges
continue to grow, creating the need for innovative mask technologies. CPL
Technology fills this need well and represents a very viable solution for
extending optical lithography well beyond 90 nm," said Chris Progler, chief
scientist, Photronics, Inc. "We are excited about partnering with ASML in the
development of this critical technology, for the benefit of the industry."

As part of the agreement, Photronics will work with ASML to help develop a
seamless CPL manufacturing flow that is optimized for Photronics' advanced mask
making process. In turn, ASML will provide Photronics with an R&D license for
its extensive portfolio of CPL Technology patents encompassing the mask making,
wafer imaging and software implementation domains. In addition, each side will
promote each other's CPL- related products and services to their common
customer base.

About Photronics

Photronics is a leading worldwide manufacturer of photomasks. Photomasks are
high-precision quartz plates that contain microscopic images of electronic
circuits. Key elements in the manufacture of semiconductors, photomasks are
used to transfer circuit patterns onto semiconductor wafers during the
fabrication of integrated circuits. They are produced in accordance with
circuit designs provided by customers at strategically located manufacturing
facilities in Asia, Europe, and North America.

About ASML MaskTools

ASML MaskTools, based in Santa Clara, California, offers leading edge optical
extension technologies and products for the semiconductor industry. Core
products include MaskWeaver for full-chip, model-based OPC/CPL(TM)/DDL(TM) mask
optimization and LithoCruiser for lithography process analysis and
optimization. As optical lithography continues to be used for volume IC
manufacturing below the wavelength of the exposure light source, these
technologies and products enhance photolithography process latitude, thereby
improving integrated circuit yields in manufacturing.

Photronics, Inc.
Michael W. McCarthy
VP Investor Relations & Corp Comm
+203 775 9000


Numerical Technologies
Jane Evans-Ryan
Account Director, MCA
+1.650.968.8900


ASML
Tom McGuire
Vice President Communications
corpcom@asml.com
+31.40.268.5758
+31.40.268.3655

ASML
Elizabeth Kitchener
Director Corporate Communications
corpcom@asml.com
+31.40.268.2602
+31.40.268.3655

ASML
Doug Marsh
Vice President Institutional Investor Relations U.S.
doug.marsh@asml.com
+1.480.383.4006
+1.480.383.3976

ASML
Craig DeYoung
Director Investor Relations
craig.deyoung@asml.com
+31.40.268.3938
+31.40.268.3655



</TEXT>
</DOCUMENT>
<DOCUMENT>
<TYPE>EX-99
<SEQUENCE>7
<FILENAME>asml_slides.txt
<DESCRIPTION>EXHIBIT 99.5 - SLIDE PRESENTATION
<TEXT>
Slide 1

ASML

ASML Introduces TWINSCAN(TM) XT:1250i
for Immersion Lithography

<PAGE>
Slide 2

ASML

Opening Remarks

Mr. Wasuke Nakano
Vice President, Executive Officer, and General Manager
Device Manufacturing Systems Business Group
Hitachi High-Technologies Corporation

<PAGE>
Slide 3

ASML

2003 Overview:  Market and ASML

Mr. Dave Chavoustie
Executive Vice President Sales
ASML

<PAGE>
Slide 4

2003 Market Overview

o    Third year of industry's worst ever downturn

o    Order activity seen in all market segments

o    Lithography innovation remains key value driver
     for next generation electronics

ASML

<PAGE>
Slide 5

Projections for lithography markets

[graphic omitted]

<TABLE>
<CAPTION>
<S>                      <C>     <C>     <C>     <C>     <C>     <C>     <C>     <C>     <C>     <C>     <C>     <C>     <C>
                         1996    1997    1998    1999    2000    2001    2002    2003    2004    2005    2006    2007    2008
Stepper (units)          1,321   1,043     695     731   1,182     789     413     401     504     723     542     398     431
Stepper (revenues)       3,608   3,562   2,730   3,235   5,321   3,792   2,816   2,965   3,960   6,492   5,529   4,290   4,916

Source:  ASML MCC
</TABLE>

ASML

<PAGE>
Slide 6

ASML has done very well:
>50% $ market share in 2002

[graphic omitted]

Source:  ASML MCC
<PAGE>
Slide 7

2003 ASML overview

o  Established market leadership
o  Reached a TWINSCAN install base of 108 systems -
   50 in Asia
o  Shipped two full-field 157-nm tools - one to IMEC
o  Introduced Ultra-k1 portfolio to extend capabilities of
   new and existing systems
o  Launched new generation TWINSCAN XT:1250

ASML
<PAGE>
Slide 8

2003 ASML Japan overview

o  Entered strategic litho-cluster engagement with TEL:
   o  Multiple tool exchanges
   o  Customer demos in Japan
o  Entered strategic joint-development litho-cluster engagement
   with Dainippon Screen
o  Secured new customer: Fuji Film Arch (FFA)
o  Successfully delivered TWINSCAN systems

ASML
<PAGE>
Slide 9

ASML

ASML and Immersion

Mr. Paul van Attekum
Senior Vice President Marketing and Technology
ASML

<PAGE>
Slide 10

300-mm product roadmap and decision points

[graphic omitted]

ASML
<PAGE>
Slide 11

Early positive immersion results

Dry (NA=0.75, sigma=0.55/0.85)   Wet (NA=0.75, sigma=0.55/0.85)

[graphic omitted]

DOF improvement in hydraulic image

<PAGE>
Slide 12

AT:1150i, 90-nm dense lines and spaces

[graphic omitted]

<PAGE>
Slide 13

TWINSCAN XT:1250i

[graphic omitted]

<PAGE>
Slide 14

TSMC selects ASML for industry's first immersion tool order

o   TSMC is an industry driver of immersion technology
o   ASML and TSMC to work closely in joint-development immersion program
o   TSMC chose ASML due to ASML's technology leadership and early
    product availability
o   TSMC to take delivery of XT:1250i in Q3 2004

<PAGE>
Slide 15

[graphic omitted]

TWINSCAN immersion changes

Use existing level sensor in air

Use existing alignment sensor in air

Integrate liquid supply system
    - temperature
    - degassing
    - purification

Liquid containment

Modified lens

Wafer stage sealing and flattening

Integrate wet-chuck swap solution

Wet-image sensor

Key advantage:  dry metrology

<PAGE>
Slide 16

Basic rules and trends of lithography

Resolution is proportional to lamda/NA

Depth of Focus is proportional to n x lamda/(NA x NA)

lamda = wavelength
NA = Numerical Aperture
n = refractive index (air = 1, water = 1.4)

Resolution, Depth of Focus
Immersion
KrF (248nm)
ArF (193nm)

[graphic omitted]

SOURCE = ASML
<PAGE>
Slide 17

Room to shrink

Smaller process windows make system performance even more critical
for die yield and to avoid rework

70 nm Process Window + Ultra - k(1)
0.85 NA ArF Scanner + Hydrolith
System and Process Requirement

[graphic omitted]

<PAGE>
Slide 18

157-nm update

o   Delivered two 157-nm systems (Micrascan VII)
    o   First 157-nm full-field tool operational at IMEC
o   ASML continues to offer 157-nm process development
o   Next generation product lines include 157-nm

<PAGE>
Slide 19

300-mm product roadmap and decision points

[graphic omitted]

<PAGE>
Slide 20

Conclusion

o   ASML marks its technology leadership with industry first -
    the XT:1250i immersion system
o   ASML secures first-ever immersion order from TSMC
o   ASML delivers on both 157-nm dry and 193-nm immersion technology -
    customers choose

<PAGE>
Slide 21

Closing Remarks

Shinji Nagatani
President ASML Japan

<PAGE>
Slide 22

ASML
Commitment

</TEXT>
</DOCUMENT>
</SEC-DOCUMENT>
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