Ad-hoc | 9 January 2002 07:31
Süss Micro Tec AG
english
SUSS MicroTec: Strategically important order for LithoPack300
Ad-hoc-announcement transmitted by DGAP.
The issuer is solely responsible for the content of this announcement.
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SUSS MicroTec: Strategically important order for LithoPack300
.Order from one of the world’s largest semiconductor packaging and testing
companies in Taiwan
.Furtherly strenthened market position in high-volume production applications
Munich, January 9, 2002- SUSS MicroTec has won a key order for the LithoPack 300
cluster tool from the one of the world’s largest semiconductor packaging and
testing companies in Taiwan. SUSS MicroTec’s LithoPack300 was chosen over
alternative technologies due to the highly integrated solution which improves
throughput, quality and reliability while reducing cost on advanced technology
products such as high performance graphic chips, microprocessors, wireless
communications and portable consumer electronics.
The LithoPack300 is a fully automated and integrated cluster solution used to
coat, expose and develop patterned wafers for wafer level packaging (WLP)
applications. According to Franz Richter, CEO of SUSS MicroTec “this
strategically important order continues to validate our strategy of offering a
high-volume production platform which provides a total system solution to our
customers and further strengthens our market position”.
SUSS MicroTec’s 300-mm cluster solution consists of an MA300 Mask Aligner module
linked to an ACS300 Spin Coating system. The tool, called the LithoPack300
(LP300), is specifically designed for wafer bumping and wafer level packaging
applications on 300mm wafers. The 300mm technology is – in contrast to the
currently used 200mm technology – the next generation in semiconductor
production and allows chip companies to increase cost efficiency in their
production.
For furhter information please contact: Barbara v. Jan, Investor Relations,
Tel.: +49(0)89-32007314
end of ad-hoc-announcement (c)DGAP 09.01.2002
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