Ad-hoc | 30 January 2003 14:27

Süss Micro Tec AG english

SUSS MicroTec: 300mm equipment convinces leading IC manufacturer Ad-hoc-announcement transmitted by DGAP. The issuer is solely responsible for the content of this announcement. ——————————————————————————– – Strategic milestone in 300mm segment has been reached – Technological lead within advanced packaging extended – Excellent positioning in future growth market confirmed Munich, January 30, 2002. SUSS MicroTecs LithoPack300 system solution will be used by another of the worlds leading chipmakers. The semiconductor manufacturer opted for the German companys solution after successful conclusion of a comprehensive one-year testing and evaluation phase of the SUSS MicroTec equipment. Compared with alternative technologies, the LithoPack300 combines high flexibility and stability and an outstanding cost of ownership. This production line, consisting of a SUSS MA300 Mask Aligner and a SUSS ACS300 Spin Coater, will be used for advanced packaging of microchips. The decision of the well-known semiconductor manufacturer in favor of the 300mm production line is an important milestone for SUSS MicroTec as this customer is a pioneer in the transition to chip production on the new 300mm wafer format. Especially for mass production, as given in 300mm applications, the cost advantage of SUSS Mask Aligner technology is significant. For queries, please contact: SÜSS MicroTec AG Tanja Satzer Investor Relations Tel.: +49 (0) 89 / 320 07-314 Fax: +49 (0) 89/ 320 07-359 E-Mail: t.satzer@suss.de end of ad-hoc-announcement (c)DGAP 30.01.2003 ——————————————————————————– WKN: 722670; ISIN: DE0007226706; Index: Listed: Geregelter Markt in Frankfurt (Prime Standard); Freiverkehr in Berlin, Bremen, Düsseldorf, Hamburg, Hannover, München und Stuttgart 301427 Jän 03