Ad-hoc | 13 September 2004 18:58

IBM and SUSS MicroTec enter into a Joint Technology Agreement

Ad-hoc-announcement transmitted by DGAP. The issuer is solely responsible for the content of this announcement. ——————————————————————————– IBM and SUSS MicroTec enter into a Joint Technology Agreement – Suss to commercialize IBM’s next generation C4 technology (C4NP) – C4NP offers reliable 100% Lead Free solder bumping solution – Significant increase in revenue potential for SUSS MicroTec Munich, Germany – September 13, 2004 – SUSS MicroTec AG (FWB: SMH) has entered into a joint agreement with IBM Corporation (NYSE: IBM) to commercializ IBM’s next generation C4 technology, C4NP. As part of the agreement, SUSS MicroTec will develop a complete line of equipment (300mm & 200mm) based on the patented C4NP technology for commercialization. IBM will continue advanced development of the technology and offer on-site process training to customers who purchase the C4NP systems from SUSS MicroTec. IBM Global Financing in Germany (IBM Deutschland Kreditbank GmbH) has committed to finance the development efforts of the C4NP equipment set and has expressed strong interest to support on-going financing requirements for future customer purchase orders. Under the terms of the agreement SUSS MicroTec will have the opportunity to share the wafer bumping royalties on all wafers manufactured utilizing the C4NP technology. First shipments of SUSS MicroTec equipment which incorporates the patented C4NP technology are expected sometime in the second half of 2005. IBM has developed and will continue to develop the C4NP technology as a lead- free bumping solution because it is the first flip chip technology to offer the combined advantages of 100% lead free, high reliability, fine pitch, lower material cost as well as flexibility to use virtually all types solder compositions. C4NP will enable IBM and other Semiconductor manufactures to implement a 100% lead-free solder bumping technology as an integral part of their wafer assembly, packaging and test solution portfolios. Environmental legislation (European Union Directive “RoHS” related to the reduction of hazardous substances) and environmental rules like Japan’s “Green Purchasing Act” will require electronic manufacturers to comply with the ban on heavy elements in electronic components including lead (Pb). With legislative and competitive market pressures, large consumer electronic manufacturers are aggressively moving towards converting their products to lead free. This deal with IBM will have significant potential for SUSS MicroTec to expand the product offering to customers in the advanced packaging market. The new set of tools available to customers as a result of the agreement will not only include our 1x Full Field (1XFF) Mask Aligner and Coat/Develop clusters but will additionally include the new C4NP toolset thereby tripling based on today’s estimation the potential value of the SUSS MicroTec related equipment share of an advanced packaging line from approximately $3M to potentially greater than $10M and expanding our position as a total solutions provider. The C4NP toolset will leverage the existing SUSS MicroTec core technology and as a result enable rapid introduction of the new C4NP technology into the advanced packaging market. end of ad-hoc-announcement (c)DGAP 13.09.2004 Issuer’s information/explanatory remarks concerning this ad-hoc-announcement: IBM pioneered Flip Chip Bonding in the late 1960s. This technology was used for the first time in 1973 with IBM System 3. Since then, billions of chips have made contact with the outside world via this process under the name IBM C4. C4 means Controlled Collapse Chip Connection and is sometimes also used as a synonym for Flip Chip Bonding. C4NP is the next generation technology of the proven C4 process. The “NP” stands for New Process. For further information please contact: SUSS MicroTec AG Barbara v. Frankenberg Investor Relations Tel.: +49 (0) 89 / 320 07-314 Fax: +49 (0) 89/ 320 07-450 E-mail: b.frankenberg@suss.de ——————————————————————————– WKN: 722670; ISIN: DE0007226706; Index: TecDAX, NEMAX 50 Listed: Geregelter Markt in Frankfurt (Prime Standard); Freiverkehr in Berlin- Bremen, Düsseldorf, Hamburg, Hannover, München und Stuttgart 131858 Sep 04