Press Release | 18 October 2011 19:54

A world leading integrated device manufacturer (IDM) selects SUSS MicroTec and TMAT for 300mm High-Volume Production of 3D Logic and Memory applications

SÜSS MicroTec AG / Key word(s): Products/Innovation/

18.10.2011 / 19:54

PRESS RELEASE

A world leading integrated device manufacturer (IDM) selects SUSS MicroTec and TMAT for 300mm High-Volume Production of 3D Logic and Memory applications

Garching, GERMANY, October 18, 2011 – SUSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor and related markets, and TMAT, a provider of process technology and adhesives for temporary bonding, have received a purchase order for SUSS MicroTec's latest generation of high volume manufacturing temporary bond clusters from a world-leading IDM. The bonder system is configured to temporarily bond 300mm wafers for 3D integration processes for logic and memory applications using the TMAT adhesive materials and the TMAT process for temporary bonding. TMAT and SUSS MicroTec have been working on process and equipment qualification over the past months in order to adapt the process to the customer specific wafer and process requirements. SUSS MicroTec's platform was chosen over competitors' offerings because of the high throughput capability resulting in a superior Cost-of-Ownership and sophisticated process control for high production volume temporary bonding. Installation of the thin wafer handling equipment is scheduled for Q4 2011.

About SUSS MicroTec
SUSS MicroTec, listed on TecDAX of Deutsche Börse AG, is a leading supplier of equipment and process solutions for microstructuring in the semiconductor industry and related markets. In close cooperation with research institutes and industry partners SUSS MicroTec contributes to the advancement of next-generation technologies such as 3D Integration and nanoimprint lithography as well as key processes for MEMS and LED manufacturing.
With a global infrastructure for applications and service SUSS MicroTec supports more than 8.000 installed systems worldwide. SUSS MicroTec is headquartered in Garching near Munich, Germany.
For more information, please visit http://www.suss.com .

About Thin Materials

Thin Materials AG was founded early 2007. The technology itself, however, is already under development for many more years and has reached market readiness.
The company is based in Munich, Germany, where it has its office and clean room facilities. Any roadmap in the semiconductor industry shows a clear trend towards thinner wafers. While the goal is clear, the paths towards it are sometimes not. The handling of ultra-thin wafers (50 µm and less) is critical. Thin Materials AG has developed a carrier technology for ultra-thin wafers. Thin Materials' technology allows to thin down wafers to 50 µm and less and to handle the thinned wafer on carrier in subsequent process steps like a 'normal' wafer. The 'Release Layer', one of Thin Materials' core technologies, allows the temporary wafer bonding and de-bonding at room temperature afterwards. High topography of 100 µm or more realized for example on bumped wafers can be handled by Thin Material's technology as well.
The company is privately held by strategic and individual investors. More information can be found at the company's website: www.thin-materials.com

For further information please contact:

SÜSS MicroTec AG
Hosgör Sarioglu
Corporate Marketing Manager
Tel: + 49 (0)89-32007-397
Email: hosgoer.sarioglu@suss.com

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Language:	English
Company:	SÜSS MicroTec AG
	Schleissheimer Strasse 90
	85748 Garching
	Germany
Phone:	+49 (0)89 32007-161
Fax:	+49 (0)89 32007-451
E-mail:	ir@suss.com
Internet:	www.suss.com
ISIN:	DE000A1K0235
WKN:	A1K023
Listed:	Regulierter Markt in Frankfurt (Prime Standard); Freiverkehr in Berlin, Düsseldorf, Hamburg, München, Stuttgart

End of News DGAP-Media

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