Media | 19 February 2014 08:15

SUSS MicroTec launches ELP300 Gen2: The Latest Generation of Excimer Laser Steppers

(DGAP-Media / 19.02.2014 / 08:15)

PRESS RELEASE

SUSS MicroTec launches ELP300 Gen2: The Latest Generation of Excimer Laser Steppers

Garching, February 19, 2014 – SUSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor industry and related markets, today announced the launch of its newest generation ELP300 Excimer Laser Stepper. This latest generation product provides a means to directly create vias (< 5µm) and microstructures, addressing the limitations of traditional photo-dielectrics and photolithography steppers for Advanced Packaging and 3D processing applications.

The Wafer Level Packaging (WLP) industry has long requested the support of alternative via generation systems that enable the development of higher performance packages. With Excimer laser ablation, alternative organic polymers can be used, which contain enhanced mechanical, physical, thermal and chemical properties, to lower cure temperatures and Coefficient Thermal Expansion (CTE) stresses. In addition, due to the ablation characteristics of the Excimer laser system, the ELP300 Gen2 provides a means to attain smaller via sizes and decreased via pitch for next generation packaging requirements.

Configured for handling both 200mm and 300mm wafers the ELP300 Gen2 platform represents a highly attractive solution that meets the technology driven requirements of the Advanced Packaging and 3D industry.

‘The demand for alternative patterning technologies that can address the limitations of traditional photolithography and photo-dielectrics is obvious’, says Frank Averdung, President and CEO of SUSS MicroTec. ‘Our new generation of Excimer laser systems will allow our customers to address the latest technical requirements with a highly cost efficient solution.’

About SUSS MicroTec
SUSS MicroTec listed in Deutsche Börse AG’s Prime Standard is a leading supplier of equipment and process solutions for microstructuring in the semiconductor industry and related markets. In close cooperation with research institutes and industry partners SUSS MicroTec is contributing to the advancement of next-generation technologies such as 3D Integration and nanoimprint lithography as well as key processes for MEMS and LED manufacturing.With a global infrastructure for applications and service SUSS MicroTec supports more than 8,000 installed systems worldwide. SUSS MicroTec is headquartered in Garching near Munich, Germany. For more information, please visit http://www.suss.com .

Contact:
SUSS MicroTec AG
Franka Schielke
Schleissheimer Strasse 90
85748 Garching, Deutschland
Tel.: +49 (0)89 32007-161
Fax: +49 (0)89 32007-451
Email: franka.schielke@suss.com

End of Media Release

Issuer: SÜSS MicroTec AG
Key word(s): Research/Technology

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Language:	English
Company:	SÜSS MicroTec AG
	Schleissheimer Strasse 90
	85748 Garching
	Germany
Phone:	+49 (0)89 32007-161
Fax:	+49 (0)89 32007-451
E-mail:	ir@suss.com
Internet:	www.suss.com
ISIN:	DE000A1K0235
WKN:	A1K023
Listed:	Regulierter Markt in Frankfurt (Prime Standard); Freiverkehr in Berlin, Düsseldorf, Hamburg, München, Stuttgart

End of News DGAP-Media

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