Media | 7 October 2014 08:00

SUSS MicroTec Launches SB6/8 Gen2: A Next-Generation Semi-Automated Permanent Wafer Bonder

(DGAP-Media / 07.10.2014 / 08:00)

SUSS MicroTec Launches SB6/8 Gen2: A Next-Generation Semi-Automated Permanent Wafer Bonder

Garching, October 7, 2014 – SUSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor and related markets, has launched the SB6/8 Gen2 Wafer Bonder today. The semi-automated SB6/8 Gen2 is SUSS MicroTec’s state of the art universal permanent wafer bonding system that handles wafers up to 200 mm and supports various substrate types and sizes.

The tool allows for fully manual processing in research and development applications while at the same time providing the opportunity of an easy switch to volume production. It supports low force for adhesive bonding as well as high force for thermo compression or eutectic bonding and offers various chamber pressure conditions from vacuum to over pressure.
Flexible tooling allows for adapting to different requirements in the semiconductor industry. Major applications are in MEMS and LED packaging and production as well as 3D stacking.

The second tool generation provides an advanced heater and force control system as well as improved cooling rates. These new features lead to a more precise control of the bonding processes.

About SUSS MicroTec
SUSS MicroTec is a leading supplier of equipment and process solutions for microstructuring in the semiconductor industry and related markets. In close cooperation with research institutes and industry partners SUSS MicroTec contributes to the advancement of next-generation technologies such as 3D Integration and nanoimprint lithography as well as key processes for MEMS and LED manufacturing. With a global infrastructure for applications and service SUSS MicroTec supports more than 8.000 installed systems worldwide. SUSS MicroTec is headquartered in Garching near Munich, Germany. For more information, please visit: www.suss.com

Contact:
SUSS MicroTec AG
Franka Schielke
Schleissheimer Strasse 90
85748 Garching, Deutschland
Tel.: +49 (0)89 32007-161
Fax: +49 (0)89 32007-451
Email: franka.schielke@suss.com

End of Media Release

Issuer: SÜSS MicroTec AG
Key word(s): Research/Technology

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Language:	English
Company:	SÜSS MicroTec AG
	Schleissheimer Strasse 90
	85748 Garching
	Germany
Phone:	+49 (0)89 32007-161
Fax:	+49 (0)89 32007-451
E-mail:	ir@suss.com
Internet:	www.suss.com
ISIN:	DE000A1K0235
WKN:	A1K023
Listed:	Regulierter Markt in Frankfurt (Prime Standard); Freiverkehr in Berlin, Düsseldorf, Hamburg, München, Stuttgart

End of News DGAP-Media

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