Title:

The Issuer's project is recommended for co-financing by the NCBiR. Theproject focuses on developing a technological solution for advancedpackaging in semiconductors.

Legal basis:

Article 17(1) MAR - inside information

Content of the Report:

The Management Board of XTPL S.A. (the "Issuer") hereby announces thaton March 11, 2026, it received notification that it had been recommendedfor funding in competition FENG.05.01-IP.01-004/25, Path B: Digitaltechnologies and innovations in deep technologies, organized by theNational Center for Research and Development ("NCBiR"), for a projectdeveloped by the Issuer entitled "Development of additive technology forthe integration of photonic integrated circuits for applications inartificial intelligence" ("Project"). The main objective of the Projectis to develop, build, and validate a prototype of a new generationprinting system designed for the heterogeneous integration of photonicand electronic integrated circuits (PIC + EIC) as part of advancedpackaging processes. The developed technology will be part of theEuropean value chain in the field of advanced semiconductors.

Total value of the Project: PLN 18,286,399.84;

Recommended co-financing amount: PLN 10,091,591.16;

Implementation period: May 1, 2026 - December 31, 2029

The final amount of co-financing may change slightly, in particular as aresult of verification of the permissible amount of de minimis aid priorto the conclusion of the agreement. The Issuer will announce theconclusion of the agreement in a separate report.