Title:

First sale of a UPD module to an industrial customer in Japan for theconstruction of a prototype industrial machine for yield management ofadvanced printed circuit boards (HDI/UHDI PCB) and substrates in thearea of advanced packaging of semiconductors

Legal basis:

Article 17(1) MAR - confidential information

Content of the Report:

The Management Board of XTPL S.A. ["Issuer", "Company", "XTPL"]announces that on 11 June 2026 the Company confirmed the acceptance ofan order for an advanced Ultra-Precise Dispensing module ["UPD module"]placed by a publicly listed Japanese manufacturer of advanced, automatedindustrial equipment for the electronics and semiconductor sector["Customer"], which concludes the sales agreement. Customer has close toforty years of experience in designing and delivering advanced,automated industrial equipment for the global electronics andsemiconductor sector.

The UPD module will be integrated into a prototype industrial machinebeing built by the Customer and used in yield management processes(improvement of production yields) for advanced HDI/UHDI PCBs (printedcircuit boards) and semiconductor substrates associated with advancedpackaging. This is the first sale of XTPL equipment to Japan.

The order is the result of a technology evaluation conducted between theparties and approximately one year of relationship development. Theproject is entering the most advanced phase of the implementationprocess ( the fourth stage), i.e. the construction of a prototypeindustrial machine integrated with the UPD module, preceding thedecision on industrial implementation (the fifth stage). The order thusexpands the most advanced part of XTPL's industrial pipeline andbroadens it to include a new geography.

A key factor in the Customer's decision is XTPL's unique ability toperform high-precision dispensing of copper traces, a materialsignificantly more difficult to dispense precisely than the silver thatdominates applications for modern displays (flat panel displays, FPD).

The ordered module is distinguished by a more advanced specification anddesign than the modules used in FPD applications, which translates intoan approximately two-fold higher unit sales value. The sale is supportedby XTPL's local distributor in Japan, PEC (Printed ElectronicsCorporation).

Delivery of the module is planned for the fourth quarter of 2026, andthe Company expects to recognize the revenue from its sale in thatperiod. Revenues generated from the fulfillment of the order will have apositive impact on XTPL S.A.'s financial results achieved in 2026, andthe potential for further cooperation may constitute a significantcontribution to further sales growth in future periods.

The Issuer's Management Board considered the sale of the UPD module tobe inside information, as its realization may have a significant impacton the Issuer's future revenue situation, the strengthening of theCompany's reputation as a supplier of industrial solutions, as well asthe way the Issuer is perceived by investors.

For the reasons described above, the information provided in thiscurrent report, in the opinion of the Issuer's Management Board, meetsthe criteria of inside information within the meaning of Article 7(1)MAR.