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Pursuant to our material event disclosures dated 03.07.2023, the Capital Markets Board's ("CMB") approval for the planned debt issue was announced in the CMB's bulletin dated 03.08.2023 (August 03, 2023) and numbered 2023/45 and the signed application form regarding the issue is presented in the attachment. The issue document will be announced on the Public Disclosure Platform upon its notification to the Company. In case of a discrepancy between the Turkish and the English versions of this disclosure statement, the Turkish version shall prevail.
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