Thursday, April 24, 2014 - Asetek® today announced that the U.S. Patent
and Trademark Office (USPTO) has issued a notice of allowance on the
company's patent claims on the groundbreaking RackCDUT Direct-to-Chip
liquid cooling technology for data centers.
RackCDU D2CT is a "free cooling" solution that captures between 60% and
80% of server heat, reducing data center cooling cost by over
50% (http://asetek.com/press-room/blog/2014/report-validating-rackcdu
-energy-savings-made-public.aspx) and allowing 2.5x-5x increases in data
center server density. D2C removes heat from
CPUs (http://asetek.com/data-center/technology/data-center
-components/cpu-cooling.aspx), GPUs (http://asetek.com/data
-center/technology/data-center-components/gpu-cooling.aspx), memory
modules (http://asetek.com/data-center/technology/data-center
-components/memory-cooling.aspx) within servers using water as hot as
40°C (105°F), eliminating the need for chilling to cool these
components.
"Needless to say I am thrilled that we have gotten allowance on our
patent claims on the RackCDU technology. Asetek's future is, to a large
extent, hinging on these claims so having the exclusivity on this
technology is key," says André Eriksen, Asetek's founder and CEO. "We
have a solution with the potential for solving one of the largest and
fastest growing energy problems on the planet and I think this has a
bright future as energy consumption, density and operating costs of data
centers will continue to rise."
Chilling is the largest portion of data center cooling OpEx and CapEx
costs. With RackCDU D2C, less air needs to be cooled and moved by
Computer Room Air Handlers (CRAH) or Computer Room Air Conditioning
(CRAC) units. Furthermore, liquid cooled servers need less airflow
resulting in more energy efficient servers.
RackCDU is capable of returning water from the data center at
temperatures high enough to enable waste heat recycling. Data centers
choosing this option recover a portion of the energy running their
servers further increasing energy cost savings, reducing carbon
footprint and resulting in cooling Energy Reuse Efficiencies (ERE) below
1.0.
RackCDU D2C is deployed at a rack/server level providing maximum
scalability. The system consists of a zero-U rack level CDU (Cooling
Distribution Unit) mounted in a 10.5 inch rack extension that includes
space for 3 additional PDUs, and direct-to-chip server coolers that
are drop in replacements (http://asetek.com/press
-room/videos/2014/timelapse-installing-asetek-liquid-cooling-inside
-cisco-220-server.aspx) for standard server air heat sinks.
About Asetek
Asetek is the world-leading provider of energy efficient liquid cooling
systems for data centers, servers, workstations, gaming and high
performance PCs. Its products are used for reducing power and greenhouse
emissions, lowering acoustic noise, and achieving maximum performance by
leading OEMs and channel partners around the globe.
Asetek's products are based upon its patented all-in-one liquid cooling
technology with more than 1.5 million liquid cooling units deployed in
the field. Founded in 2000, Asetek is headquartered in Aalborg, Denmark
with offices in California, China and Taiwan. For more information,
visit http://www.asetek.com.
For further information, please contact:
Andre S. Eriksen, Chief Executive Officer
Mobile: +1 408 398 7437, e-mail: ceo@asetek.com