November 15, 2016 - With reference to stock exchange notice June 22, 2016
announcing that Asetek had received an order from one of its existing OEM
partners for RackCDU D2CT (Direct-to-Chip) to satisfy an undisclosed HPC
customer installation in Europe, resulting in revenue to Asetek in the range of
$100,000 with installation expected to occur in Q3 2016:
Asetek® today announces that it is existing OEM partner Fujitsu® that has been
selected by the University of Regensburg to install Asetek InRackCDUT technology
to liquid cool one of the first Intel® Xeon PhiT based HPC clusters in Europe.
The Fujitsu® installation is a joint research project (SFB/TRR-55) with The
University of Wuppertal and Jülich Supercomputing Center.
"We appreciate that our OEM customer Fujitsu continue to deploy Asetek's liquid
cooling solution and increase end user adoption" said André Sloth Eriksen,
Founder and CEO of Asetek.
For the full press release go to www.asetek.com .
About Asetek
Asetek® (ASETEK.OL) is the global leader in liquid cooling solutions for data
centers, servers and PCs. Asetek's server products enable OEMs to offer cost
effective, high performance liquid cooling data center solutions. Its PC
products are targeted at the gaming and high performance desktop PC segments.
With over 3.5 million liquid cooling units deployed, Asetek's patented
technology is being adopted by a growing portfolio of OEMs and channel partners.
Founded in 2000, Asetek is headquartered in Denmark and has operations in
California, Texas, China and Taiwan. For more information visit
http://www.asetek.com.
For further information, please contact:
André S. Eriksen, Chief Executive Officer
Mobile: +45 2125 7076, e-mail: ceo@asetek.com