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LONG-TERM DEBT (Narrative) (Details)
$ in Thousands, ¥ in Billions
6 Months Ended 12 Months Ended
Jun. 30, 2025
JPY (¥)
Dec. 31, 2024
USD ($)
Dec. 31, 2024
JPY (¥)
Dec. 31, 2023
USD ($)
Dec. 31, 2022
USD ($)
Dec. 31, 2024
JPY (¥)
Sep. 23, 2023
USD ($)
Sep. 23, 2023
JPY (¥)
Dec. 31, 2021
USD ($)
Dec. 31, 2021
JPY (¥)
Debt Instrument [Line Items]                    
Outstanding capital lease liability   $ 73,453   $ 118,272            
Lease liability   24,785   40,330            
Operating Lease, Payments   4,439                
Office space operating facilities and vehicles [Member]                    
Debt Instrument [Line Items]                    
Operating Lease, Cost   4,592   $ 4,807 $ 5,867          
Tower Partners Semiconductor Co., Ltd ("TPSCo") [Member] | Term Loan 2018 [Member]                    
Debt Instrument [Line Items]                    
Outstanding principal                 $ 70,000  
Tower Partners Semiconductor Co., Ltd ("TPSCo") [Member] | 2023 JP Loan [Member]                    
Debt Instrument [Line Items]                    
Outstanding principal             $ 22,000      
Tower Partners Semiconductor Co., Ltd ("TPSCo") [Member] | 2024 JPY Loan [Member]                    
Debt Instrument [Line Items]                    
Outstanding principal   92,000                
Loan outstanding amount   $ 100,000                
Tower Partners Semiconductor Co., Ltd ("TPSCo") [Member] | JPY [Member] | Term Loan 2018 [Member]                    
Debt Instrument [Line Items]                    
Outstanding principal | ¥                   ¥ 11.0
Interest rate   1.95%       1.95%        
Description of collateral   The 2021 JPY Loan was secured mainly by a lien over the machinery and equipment of TPSCo located in the Uozu and Tonami facilities. The 2021 JPY Loan was secured mainly by a lien over the machinery and equipment of TPSCo located in the Uozu and Tonami facilities.              
Payment terms   payable in seven semiannual payments from December 2024 until December 2027. payable in seven semiannual payments from December 2024 until December 2027.              
Tower Partners Semiconductor Co., Ltd ("TPSCo") [Member] | JPY [Member] | 2023 JP Loan [Member]                    
Debt Instrument [Line Items]                    
Outstanding principal | ¥               ¥ 3.5    
Interest rate             1.95% 1.95%    
Description of collateral   The 2023 JPY Loan was secured by a second lien over the machinery and equipment of TPSCo located in the Uozu and Tonami facilities. The 2023 JPY Loan was secured by a second lien over the machinery and equipment of TPSCo located in the Uozu and Tonami facilities.              
Payment terms   payable in seven semiannual payments from September 2024 until September 2027. payable in seven semiannual payments from September 2024 until September 2027.              
Tower Partners Semiconductor Co., Ltd ("TPSCo") [Member] | JPY [Member] | 2024 JPY Loan [Member]                    
Debt Instrument [Line Items]                    
Outstanding principal | ¥           ¥ 14.5        
Interest rate             2.00% 2.00%    
Loan repaid | ¥ ¥ 3.0   ¥ 11.5              
Loan amount withdrawn | ¥ ¥ 2.0   12.5              
Loan outstanding amount | ¥     ¥ 15.5              
Description of collateral   The 2024 JPY Loan is secured mainly by a lien over the machinery and equipment of TPSCo located in the Uozu and Tonami facilities. The 2024 JPY Loan is secured mainly by a lien over the machinery and equipment of TPSCo located in the Uozu and Tonami facilities.              
Payment terms   principal payable in seven semiannual payments from December 2027 to December 2030. principal payable in seven semiannual payments from December 2027 to December 2030.